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I did a small test piece using BE on the bottom... a very thin wafer centered on the BE... and BE clear on top. This was done on thin fiber paper. I used the 'sqeeze schedule'

300 - 1250 - 60
1000 - 1510 - 15
999 - 960 - 30
210 - 700 -

I STILL got bubbles!

Any suggestions would be greatly accepted.

Thanks,
Ross

I would try soaking at a lower temp. Maybe 1175 or 1200. You've probably already trapped the air by the time you do your saok. If that doesn't do it, do a couple of soaks, one at 1125 or 1150, then crawl up 25 or 50 more degrees and soak again.

Ross wrote:I did a small test piece using BE on the bottom... a very thin wafer centered on the BE... and BE clear on top. This was done on thin fiber paper. I used the 'sqeeze schedule'

300 - 1250 - 60
1000 - 1510 - 15
999 - 960 - 30
210 - 700 -

I STILL got bubbles!

Any suggestions would be greatly accepted.

Thanks,
Ross

I'd fire twice. First to fuse the wafer smooth to the base. Then clear cap.

Or - if the piece allows -- chad the outside of the clear cap higher than the wafer (and still squeeze).

Also, I'm having trouble understanding your schedule -- it looks like your first two segments overlap.

I use this schedule when I want to squeeze:

as fast as practical for the piece to 1150
1150 - 1250 @ 50 dph - 60 min hold
1250 to full fuse afap
down as appropriate for the piece

- Paul